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LED COMPONENT PROCESS
 
Epi Growth
Fab   Probing        
 
Process Description : Grow Chemical material on sapphire substrate for LED’s own
   characteristic using growth method
Facility : MOCVD
 
 
 
Chip
Fab   Lapping & Polishing   Scribing & Breaking   Probing & Sorting
 
Process Description :
  - FAB Process : Make electrode using Etching
  - Lapping / Polishing : Grind backside of wafer
  - Scribing / Breaking : Separate to each Chip (15,000ea ~ 35,000ea / Wafer)
  - Probing / Sorting :Test Chip’s characteristic, Sort by Rank
Facility : ICP, E-Beam, Grinder, Scriber, Breaker, Prober, Sorter
 
 
 
Package
Bonding   Dispensing/Molding   Trim/Form (Dicing)   Test/Taping
 
Process Description :
  - Bonding : Place LED chip die on PCB / Lead Frame and connect wire for operation after packaging
  - Dispensing / Molding : Insert Epoxy compound on PCB / Lead frame to protect chip die / Wire
  - Trim/Form(Dicing) : Separate each product from PCB / Lead frame
  - Test / Taping : Test each product’s characteristic, Sort by Rank and Taping for SMT Mounter
Facility : Die/Wire Bonder, Dispenser, Mold Press, Trim/Form, Dicer,Tester,Taping M/C
 
Contact Details
 
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PRODUCTS
LED LIGHT BAR
- SPB 2EC
- SPB
- APB 2EC
- NPB
- NPB RGB
- NPB C5
- NPB C5 RGB
- NPB AC
- NPB I
SIGNAGE & LED ART MEDIA FLASH
- POWER BEAM C
- MATRIX BOARD
- LIGHT PANEL
 
LED DIRECT ILLUMINATION
- MR16
- GU10
- ALBULB, ALPAR
- T8 TUBE
- FLAT PANEL
- DOWN LIGHT
- LED RECESSED SPOT LIGHT I
- LED RECESSED SPOT LIGHT II
- LED RECESSED SPOT LIGHT III
- LED RECESSED SPOT LIGHT IV
LED INDUSTRIAL LIGHT
- INDUSTRIAL DOWN LIGHT
- STREET LIGHT
- SOLAR LED PROJECT
 
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